ApexM0Eng
Computer
- Feb 23, 2015
- 39
Such as devices like the one below.
Link
If you check out Page [5 of 10] you can see a diagram of the device.
Pins 6-8 and 9-11 are all mounted underneath.
I had a small board made up using the recommended pattern in this document.
I have tried using solder paste, by placing very small dabs on the pads then heating,
but I am always getting shorts between the inside and outside pins.
I really don't like the clearance between the inside pins and outside pins on the recommended
layout, but i figured it was fine.
Whats worse is I can't get in there to fix mistakes as the device is now glued down.
Is there a technique i am un-aware of or something? This is quite frustrating.
Link
If you check out Page [5 of 10] you can see a diagram of the device.
Pins 6-8 and 9-11 are all mounted underneath.
I had a small board made up using the recommended pattern in this document.
I have tried using solder paste, by placing very small dabs on the pads then heating,
but I am always getting shorts between the inside and outside pins.
I really don't like the clearance between the inside pins and outside pins on the recommended
layout, but i figured it was fine.
Whats worse is I can't get in there to fix mistakes as the device is now glued down.
Is there a technique i am un-aware of or something? This is quite frustrating.