deenor
Chemical
- Dec 1, 2002
- 14
Hi,
I'm producing a casing from a glass filled mPPO material. One of the requirement is to have surface conductivity. In order to fulfill this, we use carbon black as the conductive additive. The problem is I found the surface of the molded part tends to form blister or loose debris. The customer was horrified & is asking for improvement. Anybody has any suggestions or ideas? I've tried evaluating on process parameters but none of them ever showed any significant improvement.
regards
I'm producing a casing from a glass filled mPPO material. One of the requirement is to have surface conductivity. In order to fulfill this, we use carbon black as the conductive additive. The problem is I found the surface of the molded part tends to form blister or loose debris. The customer was horrified & is asking for improvement. Anybody has any suggestions or ideas? I've tried evaluating on process parameters but none of them ever showed any significant improvement.
regards