metalman8357
Materials
- Oct 5, 2012
- 155
I think this is a pretty basic question but I'm curious about the type of bond that is formed in soldering and brazing processes. Take a tin/lead solder onto copper for example; does a metallurgical bond form between the tin/lead solder alloy and the copper even though the copper is not melted? What type of bond is this? Is this the same type of a bond that forms if the same tin/lead solder alloy were put into contact with a molten copper alloy?
Can a parallel be drawn to cold welding? If two perfectly flat, solid metal bars are brought into contact at room temperature in a vacuum they will bond if the oxide layer is removed from each bonding surface. Is this true for liquid solder bonding to solid copper since the flux removes the oxide layer on both metals and the solder wets out onto the imperfect surface of the solid?
If this theory is true, could a tiny droplet of molten metal in vacuum bond to a much larger solid metal even though the droplet does not have enough thermal energy to melt the solid (assuming it is dropped with enough velocity to properly wet out)?
Can a parallel be drawn to cold welding? If two perfectly flat, solid metal bars are brought into contact at room temperature in a vacuum they will bond if the oxide layer is removed from each bonding surface. Is this true for liquid solder bonding to solid copper since the flux removes the oxide layer on both metals and the solder wets out onto the imperfect surface of the solid?
If this theory is true, could a tiny droplet of molten metal in vacuum bond to a much larger solid metal even though the droplet does not have enough thermal energy to melt the solid (assuming it is dropped with enough velocity to properly wet out)?